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微波電路板·高頻板·高速電路板·雙面多層板·HDI電路板·軟硬結(jié)合板
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M6 R-5775-N作為用在超高層,超高速線路板的材料,廣泛應用于通信等領(lǐng)域
頻率與傳輸損耗:
介電性能參數(shù)表:
常規(guī)性能參數(shù)表:
| Item | Test method | Condition | Unit | MEGTRON6 R-5775(N) Low Dk glass cloth | MEGTRON6 R-5775 Normal glass cloth | |
|---|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DSC | A | °C | 185 | 185 | |
| Thermal decomposition temp.(Td) | TGA | A | °C | 410 | 410 | |
| CTE x-axis | α1 | IPC-TM-650 2.4.24 | A | ppm/°C | 14-16 | 14-16 |
| CTE y-axis | 14-16 | 14-16 | ||||
| CTE z-axis | α1 | IPC-TM-650 2.4.24 | A | 45 | 45 | |
| α2 | 260 | 260 | ||||
| T288(with copper) | IPC-TM-650 2.4.24.1 | A | min | >120 | >120 | |
| Dielectric constant(Dk) | 12GHz | Balanced-type circular disk resonator | C-24/23/50 | － | 3.4 | 3.6 |
| Dissipation factor(Df) | 0.004 | 0.004 | ||||
| Water absorption | IPC-TM-650 2.6.2.1 | D-24/23 | % | 0.14 | 0.14 | |
| Flexural modulus | Fill | JIS C 6481 | A | GPa | 18 | 19 |
| Peel strength* | 1oz(35μm) | IPC-TM-650 2.4.8 | A | kN/m | 0.8 | 0.8 |